Mosaic Microsystems

Innovating chips through better packaging

Mosaic Microsystem’s proprietary VIAFFIRM® bond enables thin glass solutions for demanding next generation microelectronics and photonics packaging needs. The company has created a new class of materials capable of reducing power consumption in mobile applications, providing higher display resolution, and reducing costs by enabling lower-cost manufacturing processes. 

Mosaic Microsystems logo

CEO
Christine Whitman

FROM
Rochester, NY

SOCIAL

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