Accelerating microprocessing with lasers and liquids – literally cutting edge
LIDROTEC’s patent-pending wafer-dicing laser technology enables thinner cuts with a virtually 0% damage rate, providing significant cost savings and productivity increases to the semiconductor industry. Its innovation is in the efficient use of liquids in the laser processing zone, which cool and rinse wafers while the laser cuts out the chips. The benefits of this unique technology are thinner cuts with higher precision, no damages to the material, clean surfaces without debris, and higher processing speeds, with no adaptations needed to the production process.
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